CALL FOR ABSTRACT

International Conference on Thermal, Mechanical and Multiphysics Engineering

  • Thermal, Mechanical and Multiphysics
    Simulation and Experiments
    in Micro/Nanoelectronics and Systems
    Multi-physics simulation (thermal, mechanical, thermo-
    mechanical, coupled thermo-fluidic, coupled electro-mechanics,
    fluid structure interactions, opto-mechanics)
    Failure analysis and failure mode extraction
    Material characterisation, experiments and modelling
    Validation of simulations by experiments
    Failure criteria and damage modelling for reliability prediction
    Integrated process modelling
    Advanced numerical and analytical simulation methodologies
    and tools
    Behavioural modelling
    Simulation-based optimisation, virtual prototyping in product
    and/or process design
    Compact modelling and model order reduction
    Multiscale modeling and simulation
    Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro/Nano-Electronics and Micro/Nano-systems




Conference Date

28th - 29th June 2024

Submission Date

Early Bird Fee: 29th May 2024

Last Date for Paper Submission:8th June,2024

Last Date for Registration:18th June,2024


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