Thermal, Mechanical and Multiphysics
Simulation and Experiments
in Micro/Nanoelectronics and Systems
Multi-physics simulation (thermal, mechanical, thermo-
mechanical, coupled thermo-fluidic, coupled electro-mechanics,
fluid structure interactions, opto-mechanics)
Failure analysis and failure mode extraction
Material characterisation, experiments and modelling
Validation of simulations by experiments
Failure criteria and damage modelling for reliability prediction
Integrated process modelling
Advanced numerical and analytical simulation methodologies
and tools
Behavioural modelling
Simulation-based optimisation, virtual prototyping in product
and/or process design
Compact modelling and model order reduction
Multiscale modeling and simulation
Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro/Nano-Electronics and Micro/Nano-systems
Early Bird Fee: 1st Jan 2025
Last Date for Paper Submission:16th January,2025
Last Date for Registration:16th January,2025